PCB产品应用于人工智能领域
公司实施双主业发展战略,目前主营业务PCB项目经营状况良好,产品在VR、人工智能等领域均有应用;
先进封装
Chiplet技术将各异质小芯片借助先进封装方式实现系统芯片功能,预计将推动封装工艺与封装材料发展。公司己积极投资开展半导体先进封装IC载板业务。
6G
公司持续开展通信领域高新技术的开发,公司已针对6G通信相关新工艺、新材料和新产品进行研发立项,并结合客户需求加快新产品导入。
············································································································································